PRODUCTS
PRECISION CUTTING EQIPMENT
Precision cutting is accomplished with thin diamond blades. Wafer cutting is especially useful for cutting ceramics and minerals as well as some metallic materials.
PRECISION CUTTING EQIPMENT
MICRACUT 200-S
Micracut 200-S ensures exceptional precision for samples up to ø75 mm, featuring automatic X and Y axis movements. Its servo-controlled cutting system allows precise and controlled ..
