Sample Preparation For Electronics & Semiconductor
PRODUCTS
SAMPLE PREPARATION FOR ELECTRONICS & SEMICONDUCTOR
Electronics & semiconductor samples can be grouped in four different groups: Silicon wafer, chip based components, electronic components and printed circuit boards (PCB). The metallographic inspection is done usually on chip based components and electronics components for inspecting cavities, cracks, soldering errors, conductive layers etc. The structrure of chip based and electronics components are very small, which require very high precise sample preparation equipment.
SAMPLE PREPARATION FOR ELECTRONICS & SEMICONDUCTOR
The goal of sample preparation is to make visible hidden layers inside the sample or reveal interested inspection area. This can be done with precise grinding. If inspection area is at very deep from the sample edge, in this case cutting method can be used for reduce total grinding depth. After cutting and grinding, the next step is polishing. After polishing, the scratches are removed and the microstructure can be seen under microscope clearly.
Metkon provides special sample preparation solution for electronic components and semiconductors.
CONSUMABLES
High-quality consumables are essential for achieving consistent and accurate sample preparation results.
Metkon provides a comprehensive range of cutting discs, mounting resins, grinding papers, polishing cloths, and other essential accessories.
Our consumables are designed for durability and performance, ensuring optimal results in material testing and preparation processes.
GET YOUR BROCHURE FOR
SAMPLE PREPARATION
Discover everything you need to know about the Sample Preparation with our comprehensive brochure.
