PRODUCTS
MICRACUT 200-S
Automatic High-Speed Precision Cutter
MICRACUT 200-S is a high-speed automatic precision cutting machine that used for precise and deformation-free cutting of “Metals, Ceramics, Electronic Components, Crystals, Composites, Biomaterials, Sintered Carbides, Minerals, etc.” MICRACUT 200-S has also grinding capability for applications that need extremely precise material removal. MICRACUT 200-S has its place in virtually any metallurgical, geological, electronics, research, biomedical or industrial laboratory. The applications are endless. The cut surface is ready for microscopic examination with minimal polishing.
MICRACUT 200-S
MICRACUT 200-S is capable of cutting most materials such as, brittle or ductile metals, hard or soft metals, composites, ceramics, rocks, biomaterials, laminates, electronic components, PCB boards, sheet metals etc. It is designed for cutting all types of materials with minimal structural deformation. In addition, MICRACUT 200-S is able to make precise grinding with high accuracy. MICRACUT 200-S has special design for universal use.
• Universal use for very wide range of applications
• Suitable for both precise cutting and precise grinding
• Ability to cut PCBs and flat samples
• Programmable with colored HMI touch screen controls
• Motorized sample movement in Z-axis
• Precise X-axis positioning
• Inbuilt recirculation coolant tank






BENEFITS
Metkon products optimize your sample preparation processes with high precision, efficiency, and ease of use.


SPECIAL DESIGN FOR UNIVERSAL USE
- Ability to make simple and quick manual cutting without any program settings.
- Ability to make precise automatic cutting with advanced cutting methods.
- Ability to make semi-automatic parallel cutting.
SPECIAL DESIGN FOR ELECTRONIC/SEMICONDUCTOR SAMPLES
- Ability to make semi-automatic or manual precise grinding with 5 µm accuracy.
- Suitable for samples that needs extremely precise material removal such as electronic/semiconductor samples.


SPECIAL DESIGN FOR PCB CUTTING
- Ability to use Fixed or Movable Table attachments for cutting extra flat samples like PCB, sheet metal etc.
- Ability to make parallel cutting with specific thickness on these extra flat samples.
MICRACUT 200-S REDUCES TOTAL SAMPLE PREPARATION TIME FOR ELECTRONIC & SEMICONDUCTOR
- Precise grinding capability of MICRACUT 200-S allows precise material removal from electronic components.
- Electronic micrometers allows precise sample positioning in X-axis with 5μm accuracy. Thus, inspection area can be revealed very precisely.
- Optional cutting table attachments can be mounted on MICRACUT 200-S. Thus, the electronic components can be easily and quickly removed from the PCB boards.
- The Hybrid Cutting feature allows to set different cutting parameters on different zones of sample in the same cutting operation. This allows deformation-free cutting on multi-layer components.

ADVANCED CUTTING METHODS
- “Hybrid Cutting” feature allows to cut the samples which consist of more than one layers that needs to be cut with different parameters.
- “Rapid Pulse Cutting” feature eliminates heat generation and reduces cutting time.
- “Instafeed” feature allows fastest cutting without burning specimen. Feedrate is optimized according to the specimen hardness and contact of cutting area depending on the motor load.
FEATURES
A wide product range, programmable controls, and durable construction meet all sample preparation needs.
PRECISE X-AXIS POSITIONING WITH 5 µm ACCURACY
Ability to make semi-automatic or manual precise grinding with 5 µm accuracy.
7" TOUCH HMI SCREEN WITH ADVANCED CUTTING FEATURES
A large colored 7″ HMI touch screen is used for operating machine. It has advanced software with very easy use. All cutting parameters [Wheel Speed, Feedrate, Travel, Cutting Modes, Starting Position, etc…] can be set and stored in memory under a specific program number.
OPTIONAL FIXED OR MOVABLE CUTTING TABLE ATTACHMENTS
Ability to use Fixed or Movable Table attachments for cutting extra flat samples like PCB, sheet metal etc.
INTEGRATED RECIRCULATION COOLING UNIT
A 9 liters capacity coolant tank is located inside the machine including pump system. No external recirculation system is required. It does not take up extra space in your laboratory.
ERGONOMIC ARM FOR QUICK MANUAL CUTTING WITHOUT PARAMETER SETTINGS
Ability to make simple and quick manual cutting without any program settings.
AUTOMATIC CUTTING & AUTOMATIC GRINDING
- Ability to make precise automatic cutting with advanced cutting methods.
- Ability to make semi-automatic parallel cutting.

TECHNICAL DATA
Technical specifications compliant with international standards ensure reliable and consistent results.
ORDER NO | 16 07 |
MODEL NO | MICRACUT 200-S |
Cut-off Wheel Diameter, (mm) | up to Ø200 mm |
Cutting Capacity, Ø (mm) | Ø75 mm |
Sample Movement in Z-Axis | Motorized |
Sample Movement in X-Axis | Manual |
X-Axis Positioning Range, (mm) | 0-50 mm |
X-Axis Positioning Accuracy, (μm) | 5 μm |
Cutting Feed Speed, (μm/s) | 5 - 10000 μm/s |
Cutting Motor Power, (kW) (S1) | 0.55 kW |
Disc Speed, (RPM) | 100 – 5000 RPM |
Control Panel | 7" HMI Touch Screen |
Cutting Modes | Automatic Cutting in Z-Axis |
Manual Cutting in Z-Axis | |
Manual Table-Feed Cutting in Y-Axis |
Program Capacity | 99 Program Memory |
Pulse Cutting | Yes (Rapid Pulse Cutting) |
Automatic Feedrate | Yes (Instafeed Cutting) |
Multi-Section Cutting | Yes (Hybrid Cutting) |
Parallel Cutting, X-Axis | Yes (Semi-Automatic) |
Precise Grinding Feature | Yes (Manual/Semi-Automatic) |
Grinding Wheel Diameter, (mm) | Ø175 mm |
Grinding Feed Speed, (μm/s) | 500 - 50000 μm/s |
Cooling Unit, (lt) | 4.5 lt (integrated) |
Illumination | LED |
Dressing During Cutting Operation | Yes |
Motor Drive System | Direct Drive |
Dimensions, WxDxH, (mm) | 640 x 732 x 529h mm |
Weight | 90 kgs |
BROCHURE
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MICRACUT 200-S
Discover everything you need to know about the Micracut 200-S with our comprehensive brochure.

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