Cutting
PRODUCTS
CUTTING
The first step in preparing a specimen for metallographic or micro structural analysis is to locate the area of interest. Sectioning or cutting is the most common technique for obtaining this area of interest. Proper sectioning guarantees minimal micro structural damage. Excessive subsurface damage and damage to secondary phases (e.g. graphite flakes, nodules or grain pull-out) should be avoided.
CUTTING EQUIPMENT
Sectioning can be categorized into two areas: Abrasive Cutting and Precision Wafer Cutting. Abrasive cutting is generally used for metal specimens and is accomplished with silicon carbide or alumina abrasives in resin or resin rubber bonds. Proper blade selection is required to minimize burning and heat generation during cutting which degrades both the specimen surface as well as the blade cutting efficiency. Precision wafer cutting is accomplished with thin diamond blades. Wafer cutting is especially useful for cutting ceramics and minerals as well as some metallic materials.
ABRASIVE CUTTING EQUIPMENT
CUTTING ACCESSORIES
We have a wide range of metallographic cutting accessories for different materials, workpiece sizes and section shapes.
CUTTING CONSUMABLES
Sample preparation starts with cutting and good cutting means a good start. Selecting the right cut-o wheel ensures freedom from burn and distortion and is the best way to save time and consumables. Correct cutting produce specimens which are in perfect condition for the next preparation steps.
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SAMPLE PREPARATION
Discover everything you need to know about the Sample Preparation with our comprehensive brochure.
